125-26 Part A/ B119-44導(dǎo)電雙組分環(huán)氧油墨

125-26 Part A/ B119-44導(dǎo)電雙組分環(huán)氧油墨

說明：125-26是一種雙組分耐溶劑導(dǎo)電油墨，適用于絲網(wǎng)印刷

具有細(xì)線寬和間距的電路。本產(chǎn)品與ITO涂層表面具有良好的附著力，

聚酰亞胺、聚酯、玻璃、聚碳酸酯等基材。這種產(chǎn)品對甲基乙基有很強(qiáng)的抵抗力

酮和其他腐蝕性溶劑。它也非?？构蝹驼酆邸Ｒ恍?yīng)用程序

125-26包括但不限于觸摸屏母線、太陽能電池網(wǎng)格線、聚酰亞胺的EMI/RFI屏蔽

柔性電路、聚合物厚膜電路和薄膜開關(guān)。本產(chǎn)品設(shè)計(jì)用于交叉路口

對于cmi產(chǎn)品116-20，紫外固化電介質(zhì)或118-08，熱固化電介質(zhì)。125-26是

118-09A/B。

配合比（按重量計(jì)）：A部分B119-44

100 1.5分

適用期：4天。

混合說明：在加入固化劑之前，在原容器中預(yù)混料125-26 A部分。增加B119-44

攪拌均勻。此時(shí)，可通過添加少量CMI 113-12稀釋劑來稀釋材料。

典型固化特性：

稠度光滑膏

填充銀

銀含量（固化）>85

抗皺性佳

薄板電阻率（ohm/sq./mil）低至0.015（其他數(shù)據(jù)見下面的固化計(jì)劃）

可焊性編號

水解穩(wěn)定性優(yōu)異

有效溫度范圍（攝氏度）-55至200

熱穩(wěn)定性（攝氏度）達(dá)到200

固化計(jì)劃和導(dǎo)電性：

固化溫度

（攝氏度）

可達(dá)到的固化時(shí)間電導(dǎo)率

（Ω/sq/mil）

100 1小時(shí)<0.060

150 30分鐘<0.030

150 1小時(shí)<0.020

175 30分鐘<0.020

175 1小時(shí)<0.015

注：固化時(shí)間是建議，建議客戶試驗(yàn)在其應(yīng)用中有效的方法。

儲存：25°C下，未開封、未混合的容器中保存12個(gè)月。

安全和操作：在通風(fēng)良好的情況下使用。遠(yuǎn)離火花和明火。避免長時(shí)間

接觸皮膚和吸入蒸汽。用肥皂和水清洗皮膚。注：這并不罕見

使B部分結(jié)晶。在水浴中加熱至40-45°C，使材料恢復(fù)原狀

粘度。結(jié)晶不會以任何方式影響產(chǎn)品的性能。

125-26 Part A/ B119-44導(dǎo)電雙組分環(huán)氧油墨

 125-26 Part A/ B119-44
ELECTRICALLY CONDUCTIVE, FINE LINE, TWO PART EPOXY INK
DESCRIPTION: 125-26 is a two component, solvent-resistant, electrically conductive ink suitable for screen-printing
circuits with fine line widths and spacing. This product features excellent adhesion to ITO coated surfaces,
polyimide, polyester, glass, polycarbonate and other substrates. This product is very resistant to methyl ethyl
ketone and other aggressive solvents. It is also very resistant to scratching and creasing. Some applications for
125-26 include, but are not limited to, touch screen bus bars, solar cell grid lines, emi/rfi shielding of polyimide
flexible circuits, polymer thick film circuitry, and membrane switches. This product is designed for use in crossovers
with CMI product 116-20, a UV curable dielectric or 118-08, a thermal cure dielectric. 125-26 is a fine line version of
118-09A/B.
MIX RATIO (by weight): Part A Part B119-44
100 1.5
Pot Life: 4 days.
MIXING INSTRUCTIONS: Premix 125-26 Part A, in original container prior to adding curing agent. Add B119-44
and mix until uniform. At this point the material may be thinned by adding small amounts of CMI 113-12 thinner.
TYPICAL CURED PROPERTIES:
Consistency Smooth Paste
Filler Silver
Percent Silver (cured) > 85
Crease Resistance Excellent
Sheet Resistivity (ohm/sq./mil) as low as 0.015 (See cure schedule below for additional data)
Solderable No
Hydrolytic Stability Excellent
Useful Temperature Range (°C) -55 to 200
Thermal Stability (°C) Good to 200
CURE SCHEDULE AND CONDUCTIVITY:
Cure Temperature
(°C)
Cure Time Conductivity Achievable
(Ω/sq/mil)
100 1 Hour < 0.060
150 30 Minutes < 0.030
150 1 Hour < 0.020
175 30 Minutes < 0.020
175 1 Hour < 0.015
Note: Cure times are suggestions and customers are advised to experiment for what works best in their application.
STORAGE: Shelf life: 12 months at 25°C, in unopened, unmixed containers.
SAFETY & HANDLING: Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged
contact with skin and breathing of vapors. Wash with soap and water to remove from skin. Note: It is not unusual
for crystallization of the Part B to occur. Warm to 40-45°C in a water bath to return the material to it's original
viscosity. The crystallization does not affect the performance of the product in any way.